Semiconductor package and method of manufacturing the semiconductor package

A method of manufacturing a semiconductor package, comprising;

• mounting a first semiconductor device on an interposer, the first semiconductor device including a first region and a second region;
• mounting at least one second semiconductor device on the interposer to be spaced apart from the first semiconductor device;
• forming a sealing material on the interposer to cover the first semiconductor device and the at least one second semiconductor device;
• partially removing the sealing material to form a sealing member that exposes upper surfaces of the first semiconductor device and the at least one second semiconductor device;
• and
• forming concavo-convex patterns respectively in upper surfaces of the first semiconductor device and the at least one second semiconductor device,
• wherein the concavo-convex patterns include a first concavo-convex pattern covering the first semiconductor device, the first concavo-convex pattern including
• a plurality of first pillar structures provided in an upper surface of a first region of the first semiconductor device, the first pillar structures having a first width, and
• a plurality of second pillar structures provided in an upper surface of a second region of the first semiconductor device, the second pillar structures having a second width greater than the first width.

A method of manufacturing a semiconductor package, comprising;

• providing an interposer;
• mounting a first semiconductor device on the interposer, the first semiconductor device including a first region and a second region;
• mounting at least one second semiconductor device on the interposer to be spaced apart from the first semiconductor device;
• forming a sealing member covering the first semiconductor device and the at least one second semiconductor device on the interposer and exposing upper surfaces of the first semiconductor device and the at least one second semiconductor device;
• forming a plurality of first pillar structures in an upper surface of the first region of the first semiconductor device, the plurality of first pillar structures having a first width;
• forming a plurality of second pillar structures in an upper surface of the second region of the first semiconductor device, the plurality of second pillar structures having a second width greater than the first width;
• forming a plurality of third pillar structures in an upper surface of the at least one second semiconductor device;
• mounting the interposer on the package substrate via conductive bumps;
• forming a reinforcing member extending on the package substrate to surround the interposer;
• providing a thermal interface material layer on the upper surfaces of the first semiconductor device and the at least one second semiconductor device;
• and
• providing a heat slug on the reinforcing member and the thermal interface material layer.