H10W 74/121
By multiple encapsulations
Official title: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
H10W74/121 (By multiple encapsulations) appears on 3,274 US grants and 4,361 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,274
- Published applications
- 4,361
- Assignees
- 634
- Inventors
- 6,045
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 15 | 0 |
| 1993 | 9 | 0 |
| 1994 | 13 | 0 |
| 1995 | 14 | 0 |
| 1996 | 12 | 0 |
| 1997 | 14 | 0 |
| 1998 | 12 | 0 |
| 1999 | 25 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 9 |
| 2002 | 18 | 30 |
| 2003 | 22 | 26 |
| 2004 | 25 | 53 |
| 2005 | 30 | 32 |
| 2006 | 39 | 69 |
| 2007 | 34 | 44 |
| 2008 | 32 | 100 |
| 2009 | 37 | 96 |
| 2010 | 58 | 83 |
| 2011 | 68 | 89 |
| 2012 | 76 | 85 |
| 2013 | 76 | 112 |
| 2014 | 120 | 157 |
| 2015 | 130 | 191 |
| 2016 | 176 | 201 |
| 2017 | 190 | 194 |
| 2018 | 171 | 209 |
| 2019 | 234 | 290 |
| 2020 | 232 | 279 |
| 2021 | 226 | 296 |
| 2022 | 211 | 338 |
| 2023 | 241 | 340 |
| 2024 | 229 | 380 |
| 2025 | 229 | 375 |
| 2026 | 169 | 283 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package with stacked dies and thermal substrate encapsulation6 Oct 2026US 12,757,780 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,796 B2Samsung Electronics Co., Ltd.
- Semiconductor devices and methods of making semiconductor devices having embedded photonic bridge die6 Oct 2026US 12,757,798 B2STATS ChipPAC Pte. Ltd.
- Microelectronic device29 Sep 2026US 12,751,316 B2VisEra Technologies Company Limited
- Semiconductor package with stacked members8 Oct 2026US 2026/0314415 A1Samsung Electronics Co., Ltd.
- Semiconductor Device and Method of Making a Dual-Side Molded System-in-Package with Tall components and Patterned E-Bars8 Oct 2026US 2026/0314469 A1JCET STATS ChipPAC Korea Limited
- Semiconductor Device and Method of Making Using a Die and Pillar First Approach8 Oct 2026US 2026/0314473 A1STATS ChipPAC Pte. Ltd.
- Semiconductor device8 Oct 2026US 2026/0314474 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
Most cited
By later US patents
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017
- Package with a fan-out structure and method of forming the same579US 8,785,299 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Package with passive devices and method of forming the same576US 8,809,996 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014