Semiconductor Device and Method of Making Using a Die and Pillar First Approach
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsYi Xiang Jasper Tay, Swain Hong Alfred Yeo, Chee Meng Law, Junyi Zeng
Life of this patent
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Abstract
A semiconductor device has a semiconductor die and a conductive pillar disposed adjacent to the semiconductor die. An encapsulant is deposited over the semiconductor die and conductive pillar. A first conductive layer is formed directly on the encapsulant, conductive pillar, and semiconductor die. A second conductive layer is formed directly on the encapsulant, conductive pillar, and semiconductor die opposite the first conductive layer.
Claims25
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- disposing a conductive pillar adjacent to the semiconductor die;
- depositing an encapsulant over the semiconductor die and conductive pillar;
- forming a first conductive layer directly on the encapsulant, conductive pillar, and semiconductor die;
- and
- forming a second conductive layer directly on the encapsulant, conductive pillar, and semiconductor die opposite the first conductive layer.
A method of making a semiconductor device, comprising:
- providing a semiconductor die;
- disposing a conductive element adjacent to the semiconductor die;
- depositing an encapsulant over the semiconductor die and conductive element;
- and
- forming a first conductive layer directly on the encapsulant and semiconductor die.
A semiconductor device, comprising:
- a semiconductor die;
- a conductive pillar disposed adjacent to the semiconductor die;
- an encapsulant deposited over the semiconductor die and conductive pillar;
- a first conductive layer formed directly on the encapsulant, conductive pillar, and semiconductor die;
- and
- a second conductive layer formed directly on the encapsulant, conductive pillar, and semiconductor die opposite the first conductive layer.
A semiconductor device, comprising:
- a semiconductor die;
- a conductive element disposed adjacent to the semiconductor die;
- an encapsulant deposited over the semiconductor die and conductive element;
- and
- a first conductive layer formed directly on the encapsulant and semiconductor die.
Dependencies are inferred from the claim text.