H10W 74/114
By a substrate and the encapsulations
Official title: {by a substrate and the encapsulations}
H10W74/114 (By a substrate and the encapsulations) appears on 16,058 US grants and 20,720 published applications in this corpus.
Search patents in H10W- Granted patents
- 16,058
- Published applications
- 20,720
- Assignees
- 1,613
- Inventors
- 17,793
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 6 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 9 | 0 |
| 1990 | 8 | 0 |
| 1991 | 5 | 0 |
| 1992 | 10 | 0 |
| 1993 | 16 | 0 |
| 1994 | 23 | 0 |
| 1995 | 28 | 0 |
| 1996 | 32 | 0 |
| 1997 | 49 | 0 |
| 1998 | 102 | 0 |
| 1999 | 107 | 0 |
| 2000 | 109 | 0 |
| 2001 | 125 | 60 |
| 2002 | 176 | 249 |
| 2003 | 196 | 259 |
| 2004 | 254 | 381 |
| 2005 | 230 | 390 |
| 2006 | 251 | 401 |
| 2007 | 264 | 461 |
| 2008 | 237 | 538 |
| 2009 | 276 | 519 |
| 2010 | 406 | 585 |
| 2011 | 493 | 621 |
| 2012 | 480 | 680 |
| 2013 | 574 | 685 |
| 2014 | 650 | 719 |
| 2015 | 684 | 814 |
| 2016 | 744 | 778 |
| 2017 | 801 | 892 |
| 2018 | 867 | 989 |
| 2019 | 974 | 1275 |
| 2020 | 1063 | 1516 |
| 2021 | 1070 | 1306 |
| 2022 | 1025 | 1278 |
| 2023 | 1041 | 1369 |
| 2024 | 969 | 1689 |
| 2025 | 997 | 1429 |
| 2026 | 665 | 837 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and manufacturing method of semiconductor package6 Oct 2026US 12,757,758 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including preformed support structure6 Oct 2026US 12,757,779 B2Samsung Electronics Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Die edge structure for molding compound filling and the methods of forming the same8 Oct 2026US 2026/0314288 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015