H10W 74/117
The substrate having spherical bumps for external connection
Official title: {the substrate having spherical bumps for external connection}
H10W74/117 (The substrate having spherical bumps for external connection) appears on 10,880 US grants and 14,133 published applications in this corpus.
Search patents in H10W- Granted patents
- 10,880
- Published applications
- 14,133
- Assignees
- 933
- Inventors
- 10,949
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 3 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 30 | 0 |
| 1998 | 52 | 0 |
| 1999 | 54 | 0 |
| 2000 | 58 | 0 |
| 2001 | 68 | 33 |
| 2002 | 107 | 160 |
| 2003 | 128 | 190 |
| 2004 | 174 | 287 |
| 2005 | 170 | 285 |
| 2006 | 191 | 295 |
| 2007 | 199 | 337 |
| 2008 | 185 | 369 |
| 2009 | 192 | 377 |
| 2010 | 303 | 413 |
| 2011 | 372 | 410 |
| 2012 | 346 | 474 |
| 2013 | 403 | 491 |
| 2014 | 457 | 492 |
| 2015 | 460 | 529 |
| 2016 | 500 | 488 |
| 2017 | 512 | 534 |
| 2018 | 582 | 648 |
| 2019 | 663 | 856 |
| 2020 | 713 | 1030 |
| 2021 | 720 | 917 |
| 2022 | 687 | 844 |
| 2023 | 730 | 901 |
| 2024 | 675 | 1229 |
| 2025 | 697 | 1016 |
| 2026 | 430 | 528 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including preformed support structure6 Oct 2026US 12,757,779 B2Samsung Electronics Co., Ltd.
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Lid Structure With Openings To Alleviate Leakage Of Thermal Interface Material Of A Chip Assembly8 Oct 2026US 2026/0314397 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
- Semiconductor package and cooling system thereof8 Oct 2026US 2026/0314414 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015