H10W 74/15
On active surfaces of flip-chip devices
Official title: on active surfaces of flip-chip devices, e.g. underfills
H10W74/15 (On active surfaces of flip-chip devices) appears on 15,421 US grants and 18,836 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,421
- Published applications
- 18,836
- Assignees
- 1,526
- Inventors
- 17,053
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 7 | 0 |
| 1990 | 6 | 0 |
| 1991 | 11 | 0 |
| 1992 | 16 | 0 |
| 1993 | 20 | 0 |
| 1994 | 22 | 0 |
| 1995 | 31 | 0 |
| 1996 | 38 | 0 |
| 1997 | 49 | 0 |
| 1998 | 112 | 0 |
| 1999 | 168 | 0 |
| 2000 | 181 | 0 |
| 2001 | 272 | 146 |
| 2002 | 316 | 395 |
| 2003 | 336 | 390 |
| 2004 | 338 | 508 |
| 2005 | 331 | 539 |
| 2006 | 364 | 548 |
| 2007 | 332 | 556 |
| 2008 | 356 | 590 |
| 2009 | 340 | 609 |
| 2010 | 467 | 583 |
| 2011 | 489 | 590 |
| 2012 | 495 | 687 |
| 2013 | 599 | 738 |
| 2014 | 688 | 849 |
| 2015 | 685 | 838 |
| 2016 | 827 | 816 |
| 2017 | 822 | 759 |
| 2018 | 759 | 771 |
| 2019 | 784 | 890 |
| 2020 | 786 | 1015 |
| 2021 | 720 | 1054 |
| 2022 | 766 | 1033 |
| 2023 | 857 | 990 |
| 2024 | 789 | 1146 |
| 2025 | 756 | 1093 |
| 2026 | 476 | 703 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Semiconductor packages, semiconductor device and method for manufacturing a semiconductor package6 Oct 2026US 12,757,765 B2Seriphy Technology Corporation
- Chiplet-fine-interconnection-package structure and method of manufacturing the same6 Oct 2026US 12,757,767 B2Institute of Semiconductors, Guangdong Academy of Sciences
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Two-sided liquid cooling8 Oct 2026US 2026/0314413 A1Adeia Semiconductor Bonding Technologies Inc.
- Semiconductor package with stress-relief structures8 Oct 2026US 2026/0314422 A1Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314429 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016