H10W 74/01
Manufacture or treatment
H10W74/01 (Manufacture or treatment) appears on 21,712 US grants and 26,109 published applications in this corpus.
Search patents in H10W- Granted patents
- 21,712
- Published applications
- 26,109
- Assignees
- 2,216
- Inventors
- 23,405
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 16 | 0 |
| 1978 | 11 | 0 |
| 1979 | 13 | 0 |
| 1980 | 20 | 0 |
| 1981 | 11 | 0 |
| 1982 | 8 | 0 |
| 1983 | 5 | 0 |
| 1984 | 9 | 0 |
| 1985 | 17 | 0 |
| 1986 | 16 | 0 |
| 1987 | 14 | 0 |
| 1988 | 15 | 0 |
| 1989 | 27 | 0 |
| 1990 | 25 | 0 |
| 1991 | 38 | 0 |
| 1992 | 54 | 0 |
| 1993 | 47 | 0 |
| 1994 | 67 | 0 |
| 1995 | 74 | 0 |
| 1996 | 70 | 0 |
| 1997 | 99 | 0 |
| 1998 | 150 | 0 |
| 1999 | 214 | 0 |
| 2000 | 221 | 0 |
| 2001 | 332 | 163 |
| 2002 | 362 | 487 |
| 2003 | 408 | 461 |
| 2004 | 386 | 517 |
| 2005 | 357 | 545 |
| 2006 | 377 | 545 |
| 2007 | 343 | 577 |
| 2008 | 328 | 609 |
| 2009 | 358 | 694 |
| 2010 | 519 | 713 |
| 2011 | 607 | 813 |
| 2012 | 596 | 850 |
| 2013 | 767 | 971 |
| 2014 | 904 | 1107 |
| 2015 | 1000 | 1255 |
| 2016 | 1183 | 1248 |
| 2017 | 1283 | 1342 |
| 2018 | 1225 | 1279 |
| 2019 | 1252 | 1431 |
| 2020 | 1258 | 1646 |
| 2021 | 1211 | 1529 |
| 2022 | 1167 | 1503 |
| 2023 | 1180 | 1596 |
| 2024 | 1152 | 1705 |
| 2025 | 1152 | 1486 |
| 2026 | 757 | 1037 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package structures and methods of manufacturing the same6 Oct 2026US 12,757,734 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Packaging structure having organic interposer layer and method for manufacturing same6 Oct 2026US 12,757,749 B2SJ Semiconductor(Jiangyin) Corporation
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Production method for boron nitride particles, production method for resin composition, and uses therefor8 Oct 2026US 2026/0307992 A1Resonac Corporation
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Die edge structure for molding compound filling and the methods of forming the same8 Oct 2026US 2026/0314288 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Manufacturing method of the semiconductor package8 Oct 2026US 2026/0314301 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015