H10W 74/014
Using batch processing
Official title: {using batch processing}
H10W74/014 (Using batch processing) appears on 6,850 US grants and 8,736 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,850
- Published applications
- 8,736
- Assignees
- 905
- Inventors
- 8,403
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 6 | 0 |
| 1999 | 9 | 0 |
| 2000 | 17 | 0 |
| 2001 | 33 | 26 |
| 2002 | 47 | 79 |
| 2003 | 63 | 71 |
| 2004 | 62 | 79 |
| 2005 | 71 | 94 |
| 2006 | 67 | 107 |
| 2007 | 71 | 138 |
| 2008 | 80 | 152 |
| 2009 | 80 | 174 |
| 2010 | 138 | 173 |
| 2011 | 160 | 252 |
| 2012 | 181 | 287 |
| 2013 | 243 | 378 |
| 2014 | 305 | 401 |
| 2015 | 393 | 470 |
| 2016 | 449 | 465 |
| 2017 | 457 | 495 |
| 2018 | 437 | 492 |
| 2019 | 495 | 557 |
| 2020 | 489 | 655 |
| 2021 | 471 | 596 |
| 2022 | 474 | 562 |
| 2023 | 440 | 598 |
| 2024 | 444 | 594 |
| 2025 | 428 | 585 |
| 2026 | 237 | 256 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Die package structure and method for forming the same29 Sep 2026US 12,751,314 B2Winbond Electronics Corp.
- Chip-on-wafer-on-board structure using spacer die and methods of forming the same29 Sep 2026US 12,751,320 B2Taiwan Semiconductor Manufacturing Company.Ltd
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- Method for manufacturing electronic component device and stencil-integrated mask frame8 Oct 2026US 2026/0314468 A1Resonac Corporation
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Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016