Seal rings in integrated circuit package and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Pin Chang, Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Der-Chyang Yeh
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Abstract
In an embodiment, a package includes an integrated circuit die comprising a first insulating bonding layer and a first semiconductor substrate and an interposer comprising a second insulating bonding layer, a first seal ring, and a second semiconductor substrate. The second insulating bonding layer is directly bonded to the first insulating bonding layer with dielectric-to-dielectric bonds, and wherein the integrated circuit die overlaps the first seal ring. A sidewall of the integrated circuit die is exposed at an outer sidewall of the package.
Claims20
A package comprising:
- an integrated circuit die comprising a first insulating bonding layer and a first semiconductor substrate;
- and
- an interposer comprising a second insulating bonding layer, a first seal ring, and a second semiconductor substrate, wherein the second insulating bonding layer is directly bonded to the first insulating bonding layer with dielectric-to-dielectric bonds, and wherein the integrated circuit die overlaps the first seal ring, and wherein a sidewall of the integrated circuit die is exposed at an outer sidewall of the package.
A package comprising:
- a first integrated circuit die comprising a first semiconductor substrate;
- a second integrated circuit die comprising a second semiconductor substrate;
- a molding material between the first integrated circuit die and the second integrated circuit die;
- and
- an interposer bonded to the first integrated circuit die and the second integrated circuit die, the interposer comprising a first seal ring and a third semiconductor substrate, and wherein the first integrated circuit die and the second integrated circuit die overlap the first seal ring.
A package comprising:
- a first package component, comprising:
- an integrated circuit die comprising a first semiconductor substrate;
- and
- an interposer bonded to the integrated circuit die and comprising a second semiconductor substrate, the integrated circuit die overlapping a first seal ring of the interposer;
- a package substrate bonded to the first package component;
- and
- an underfill between the package substrate and the first package component, wherein the underfill interfaces a sidewall of the integrated circuit die.
Dependencies are inferred from the claim text.