H10W 74/016
Using moulds
Official title: {using moulds}
H10W74/016 (Using moulds) appears on 6,508 US grants and 7,530 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,508
- Published applications
- 7,530
- Assignees
- 891
- Inventors
- 8,976
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 5 | 0 |
| 1985 | 6 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 11 | 0 |
| 1991 | 16 | 0 |
| 1992 | 22 | 0 |
| 1993 | 18 | 0 |
| 1994 | 30 | 0 |
| 1995 | 43 | 0 |
| 1996 | 28 | 0 |
| 1997 | 49 | 0 |
| 1998 | 61 | 0 |
| 1999 | 76 | 0 |
| 2000 | 68 | 0 |
| 2001 | 100 | 50 |
| 2002 | 115 | 160 |
| 2003 | 139 | 154 |
| 2004 | 111 | 140 |
| 2005 | 109 | 151 |
| 2006 | 90 | 136 |
| 2007 | 94 | 118 |
| 2008 | 80 | 123 |
| 2009 | 68 | 123 |
| 2010 | 112 | 156 |
| 2011 | 116 | 168 |
| 2012 | 127 | 178 |
| 2013 | 150 | 215 |
| 2014 | 201 | 255 |
| 2015 | 242 | 318 |
| 2016 | 345 | 418 |
| 2017 | 408 | 465 |
| 2018 | 428 | 463 |
| 2019 | 393 | 480 |
| 2020 | 431 | 576 |
| 2021 | 446 | 527 |
| 2022 | 385 | 470 |
| 2023 | 427 | 480 |
| 2024 | 357 | 483 |
| 2025 | 343 | 386 |
| 2026 | 223 | 337 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including preformed support structure6 Oct 2026US 12,757,779 B2Samsung Electronics Co., Ltd.
- Patterned sheet MUF for complex packages and methods of producing6 Oct 2026US 12,757,781 B2Intel Corporation
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Semiconductor package structure and method for manufacturing the same8 Oct 2026US 2026/0314365 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor package8 Oct 2026US 2026/0314409 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit packages and methods of forming the same8 Oct 2026US 2026/0314423 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package with metal-insulator-metal capacitor and method of manufacturing the same1,021US 9,263,511 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Discrete polymer in fan-out packages731US 9,666,502 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2017