H10W 74/017
Auxiliary layers for moulds
Official title: {Auxiliary layers for moulds, e.g. release layers or layers preventing residue}
H10W74/017 (Auxiliary layers for moulds) appears on 489 US grants and 594 published applications in this corpus.
Search patents in H10W- Granted patents
- 489
- Published applications
- 594
- Assignees
- 176
- Inventors
- 961
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 2 |
| 2002 | 6 | 14 |
| 2003 | 10 | 9 |
| 2004 | 6 | 7 |
| 2005 | 9 | 16 |
| 2006 | 6 | 11 |
| 2007 | 5 | 13 |
| 2008 | 10 | 13 |
| 2009 | 10 | 18 |
| 2010 | 14 | 9 |
| 2011 | 8 | 12 |
| 2012 | 10 | 12 |
| 2013 | 13 | 21 |
| 2014 | 17 | 29 |
| 2015 | 18 | 35 |
| 2016 | 32 | 39 |
| 2017 | 44 | 27 |
| 2018 | 35 | 34 |
| 2019 | 24 | 30 |
| 2020 | 38 | 52 |
| 2021 | 33 | 33 |
| 2022 | 26 | 31 |
| 2023 | 32 | 33 |
| 2024 | 21 | 42 |
| 2025 | 24 | 28 |
| 2026 | 25 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure and method for manufacturing the same25 Aug 2026US 12,721,137 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Mold release film11 Aug 2026US 12,703,126 B2Sumitomo Bakelite Co., Ltd.
- Semiconductor structure and manufacturing method thereof11 Aug 2026US 12,708,000 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrical circuit body, power converter, and electrical circuit body manufacturing method4 Aug 2026US 12,702,049 B2Hitachi Astemo, Ltd.
- Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods28 Jul 2026US 12,696,802 B2
- Semiconductor package structure and method for manufacturing the same8 Oct 2026US 2026/0314365 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structure and manufacturing method thereof1 Oct 2026US 2026/0305399 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor assembly including a semiconductor package with a delamination mitigation feature1 Oct 2026US 2026/0305457 A1Infineon Technologies Austria AG
- Wire bonding method and apparatus for electromagnetic interference shielding17 Sep 2026US 2026/0282929 A1Adeia Semiconductor Technologies LLC
- Method for making semiconductor device3 Sep 2026US 2026/0262533 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices269US 7,749,882 B2Micron Technology, Inc. · 2010
- Semiconductor device package structure having column leads and a method for production thereof210US 5,900,676 ASamsung Electronics Co., Ltd. · 1999
- Semiconductor package having implantable conductive lands and method for manufacturing the same185US 6,429,508 B1Kostat Semiconductor Co., Ltd. · 2002
- Semiconductor package having implantable conductive lands and method for manufacturing the same183US 6,566,168 B2Kostat Semiconductor Co., Ltd. · 2003
- Method of manufacturing semiconductor devices and resin molding machine83US 6,344,162 B12002