Semiconductor package having implantable conductive lands and method for manufacturing the same

A method of manufacturing a semiconductor package having implantable conductive lands, the method comprising:

• a first step of attaching the bottom of a semiconductor chip to a temporary substrate on which the implantable conductive lands are formed on a tape film;
• a second step of connecting the bond pads of the semiconductor chip to the implantable conductive lands using wires;
• a third step of molding the resultant structure after the wire bonding to form a semiconductor body;
• a fourth step of detaching the tape film used as the temporary substrate from the semiconductor package body which has undergone the molding step, leaving the implantable conductive lands in the semiconductor package body;
• a fifth step of forming external connecting terminals on the implantable conductive lands fixed in the semiconductor package body;
• and
• a sixth step of taking individual semiconductor packages off a strip of the semiconductor packages having the external connecting terminals,
• wherein the tape film of the temporary substrate comprises a tape body substantially serving as a substrate and an adhesive layer easily detached from the implantable conductive lands.

A method of manufacturing a semiconductor package having implantable conductive lands, the method comprising:

• a first step of attaching the bottom of a semiconductor chip to a temporary substrate in which the implantable conductive lands are formed on a tape film;
• a second step of connecting the bond pads of the semiconductor chip to the implantable conductive lands using wires;
• a third step of molding the resultant structure after the wire bonding;
• a fourth step of taking individual semiconductor package bodies off a strip of the semiconductor package bodies which have undergone the molding step;
• and
• a fifth step of detaching the tape film used as the temporary substrate from the individual semiconductor package body, leaving the implantable conductive lands in the semiconductor package body,
• wherein the tape film of the temporary substrate comprises a tape body substantially serving as a substrate and an adhesive layer easily detached from the implantable conductive lands.

A method of manufacturing a semiconductor package having implantable conductive lands, the method comprising:

• a first step of attaching a semiconductor chip to a temporary substrate in which the implantable conductive lands are formed on a tape film such that the bond pads of the semiconductor chip are directly connected to the implantable conductive lands;
• a second step of molding onto the temporary substrate to which the semiconductor chip is attached to form a semiconductor package body;
• a third step of detaching the tape film used as the temporary substrate from the semiconductor package body after the molding step, leaving the implantable conductive lands in the semiconductor package body;
• a fourth step of forming external connecting terminals on the implantable conductive lands fixed in the semiconductor package body;
• and
• a fifth step of taking individual semiconductor package bodies off a strip of the semiconductor package bodies having the external connecting terminals,
• wherein the tape film of the temporary substrate comprises a tape body substantially serving as a substrate and an adhesive layer easily detached from the implantable conductive lands.