Method of manufacturing semiconductor devices and resin molding machine

Abstract

The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities corresponding to resin-molded parts of the semiconductor devices are formed. And, the method comprises the steps of: covering inner faces of the cavities and a parting face of one of the dies, which contacts a substrate of the semiconductor devices, with release film, which is easily peelable from the dies and resin for molding; clamping the substrate with the dies; filling the resin in the cavities; and forming the semiconductor devices by cutting the molded substrate.

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