Semiconductor device package structure having column leads and a method for production thereof

A lead frame for semiconductor packages, which comprises:

• a die pad;
• two parallel side rails on opposite sides of said die pad, each of said side rails being formed with a plurality of index holes and a plurality of through holes;
• tie bars linking said die pad to said side rails;
• column lead groups further comprising a plurality of contacting column leads arranged in a row, a plurality of linking column leads and a band,
• said contacting column leads having horizontal grooves at a middle position of walls thereof,
• said linking column leads being placed at opposite ends of said row of contacting column leads, each of said linking column leads having a projection mechanically linked to a corresponding through hole in said side rails and being formed with horizontal grooves at a middle position of walls thereof, and
• said band being in contact with said grooves of said contacting column leads and said linking column leads thereby connecting said linking column leads and said contacting column leads together;
• and
• dam bars on opposite sides of said groups of column leads and integral with said side rails.

A semiconductor device package having column leads, which comprises:

• a chip having a plurality of bonding pads on an upper surface thereof;
• a die pad bonded to a bottom surface of said chip;
• a plurality of contacting column leads on opposite sides of said die pad, said column leads having horizontal grooves at a middle position of walls thereof;
• bands in contact with said grooves of said contacting column leads for connecting said contacting column leads together;
• means for electrically connecting each of said bonding pads to a corresponding one of said contacting column leads;
• and
• an encapsulant covering said chip, die pad, contacting column leads, bands and electrical connection means, forming a package body,
• wherein said contacting column leads and said die pad extend outward from said encapsulant.