Semiconductor package structure and method for manufacturing the same

A method for forming a semiconductor package structure, comprising:

• forming a first connection structure over a carrier substrate;
• forming a via over the first connection structure;
• disposing a passive device component over the first connection structure;
• forming a molding compound to surround the via and the passive device component;
• forming a second connection structure over the molding compound;
• and
• forming a first conductor over the second connection structure,
• wherein the passive device component comprises a semiconductor substrate and a third connection structure, the third connection structure of the passive device component is disposed between the semiconductor substrate of the passive device component and the second connection structure, and the molding compound covers and is in contact with at least a portion of a top surface of the third connection structure,
• wherein sidewalls of the semiconductor substrate of the passive device component are in direct contact with the molding compound.

A method for forming a semiconductor package structure, comprising:

• forming a first connection structure over a first carrier substrate;
• forming a via over the first connection structure;
• disposing a passive device component over the first connection structure;
• forming a molding compound to surround the via and the passive device component;
• forming a second connection structure over the molding compound;
• forming a first conductor over the second connection structure;
• attaching the first conductor to a second carrier substrate;
• separating the first connection structure from the first carrier substrate;
• and
• forming a second conductor coupled to the first connection structure,
• wherein a height of the passive device component is substantially equal to a height of the via,
• wherein the passive device component comprises a third connection structure and the molding compound covers and is in contact with at least a portion of a top surface of the third connection structure.