H10W 74/019
Using temporary auxiliary substrates
Official title: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
H10W74/019 (Using temporary auxiliary substrates) appears on 6,861 US grants and 8,523 published applications in this corpus.
Search patents in H10W- Granted patents
- 6,861
- Published applications
- 8,523
- Assignees
- 814
- Inventors
- 7,212
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 7 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 15 | 0 |
| 1999 | 17 | 0 |
| 2000 | 19 | 0 |
| 2001 | 36 | 23 |
| 2002 | 50 | 87 |
| 2003 | 58 | 81 |
| 2004 | 73 | 87 |
| 2005 | 67 | 93 |
| 2006 | 70 | 93 |
| 2007 | 75 | 116 |
| 2008 | 55 | 150 |
| 2009 | 82 | 207 |
| 2010 | 144 | 242 |
| 2011 | 192 | 272 |
| 2012 | 202 | 281 |
| 2013 | 244 | 305 |
| 2014 | 295 | 322 |
| 2015 | 271 | 389 |
| 2016 | 379 | 410 |
| 2017 | 470 | 526 |
| 2018 | 438 | 481 |
| 2019 | 512 | 589 |
| 2020 | 507 | 650 |
| 2021 | 488 | 584 |
| 2022 | 474 | 591 |
| 2023 | 467 | 569 |
| 2024 | 456 | 630 |
| 2025 | 443 | 520 |
| 2026 | 229 | 225 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
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- Packaged semiconductor device with a molding compound and a method of forming the same1,039US 9,000,584 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fan-out interconnect structure and method for forming same1,030US 9,368,460 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015