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US 12,733,093 B2Granted
Use of inorganic thin non-woven dielectrics in printed circuit boards
AssigneeAdvanced Chip and Circuit Materials, Inc.
InventorsTarun Amla, Keshav Amla, Jyoti Amla
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Abstract
Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.
Claims21
A method of making a dielectric material layer, comprising:
- providing a non-woven, inorganic fabric reinforcement;
- impregnating the reinforcement with a crosslinked thermosetting polymer resin;
- drying the impregnated reinforcement;
- and
- pressing the dried impregnated reinforcement to form a dielectric material layer having a thickness of less than about 125 microns and characterized by a thickness reduction of at least 25% relative to a thickness of the non-woven, inorganic fabric reinforcement prior to pressing.
2 more elements
Dependencies are inferred from the claim text.