H05K 2201/0203
Fillers and particles
H05K2201/0203 (Fillers and particles) appears on 3,270 US grants and 3,813 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,270
- Published applications
- 3,813
- Assignees
- 1,242
- Inventors
- 8,009
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 13 | 0 |
| 1982 | 7 | 0 |
| 1983 | 11 | 0 |
| 1984 | 13 | 0 |
| 1985 | 11 | 0 |
| 1986 | 12 | 0 |
| 1987 | 32 | 0 |
| 1988 | 25 | 0 |
| 1989 | 33 | 0 |
| 1990 | 30 | 0 |
| 1991 | 31 | 0 |
| 1992 | 39 | 0 |
| 1993 | 32 | 0 |
| 1994 | 44 | 0 |
| 1995 | 42 | 0 |
| 1996 | 50 | 0 |
| 1997 | 45 | 0 |
| 1998 | 59 | 0 |
| 1999 | 61 | 0 |
| 2000 | 51 | 0 |
| 2001 | 77 | 34 |
| 2002 | 82 | 112 |
| 2003 | 90 | 119 |
| 2004 | 89 | 133 |
| 2005 | 79 | 177 |
| 2006 | 77 | 172 |
| 2007 | 82 | 192 |
| 2008 | 86 | 201 |
| 2009 | 106 | 245 |
| 2010 | 115 | 247 |
| 2011 | 132 | 176 |
| 2012 | 153 | 160 |
| 2013 | 124 | 118 |
| 2014 | 105 | 192 |
| 2015 | 104 | 197 |
| 2016 | 132 | 154 |
| 2017 | 121 | 139 |
| 2018 | 117 | 135 |
| 2019 | 122 | 130 |
| 2020 | 95 | 141 |
| 2021 | 111 | 122 |
| 2022 | 92 | 120 |
| 2023 | 92 | 102 |
| 2024 | 80 | 132 |
| 2025 | 85 | 95 |
| 2026 | 56 | 68 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- Wiring board15 Sep 2026US 12,739,972 B2KYOCERA Corporation
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Thermosetting resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, antenna device, antenna module, and communication device24 Sep 2026US 2026/0285008 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- LED lamp assembly with means to conduct heat away from the LEDS470US 6,045,240 ARelume Corporation · 2000
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Thermally protected LED array337US 5,785,418 A1998
- Semiconductor package280US 8,921,990 B2Samsung Electronics Co., Ltd. · 2014
- Component built-in module and method for producing the same277US 6,734,542 B2Matsushita Electric Industrial Co., Ltd. · 2004