H05K 2201/0263
Details about a collection of particles
H05K2201/0263 (Details about a collection of particles) appears on 345 US grants and 427 published applications in this corpus.
Search patents in H05K- Granted patents
- 345
- Published applications
- 427
- Assignees
- 221
- Inventors
- 1,072
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 9 |
| 2003 | 9 | 9 |
| 2004 | 4 | 5 |
| 2005 | 7 | 11 |
| 2006 | 1 | 14 |
| 2007 | 7 | 19 |
| 2008 | 7 | 17 |
| 2009 | 6 | 34 |
| 2010 | 13 | 26 |
| 2011 | 20 | 18 |
| 2012 | 20 | 21 |
| 2013 | 10 | 15 |
| 2014 | 11 | 28 |
| 2015 | 16 | 23 |
| 2016 | 14 | 17 |
| 2017 | 16 | 15 |
| 2018 | 12 | 12 |
| 2019 | 12 | 16 |
| 2020 | 4 | 10 |
| 2021 | 19 | 14 |
| 2022 | 7 | 27 |
| 2023 | 18 | 16 |
| 2024 | 16 | 18 |
| 2025 | 11 | 17 |
| 2026 | 8 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring board15 Sep 2026US 12,739,972 B2KYOCERA Corporation
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Method of making an interconnect substrate14 Apr 2026US 12,604,395 B2Shinko Electric Industries Co., Ltd.
- Wiring board7 Apr 2026US 12,598,700 B2KYOCERA Corporation
- Film, laminated film, laminated plate, printed wiring board, antenna substrate, antenna module, metamaterial, and electromagnetic wave absorbing film20 Aug 2026US 2026/0247529 A1FUJIFILM Corporation
- Circuit board, and semiconductor package comprising same20 Aug 2026US 2026/0247530 A1LG Innotek Co., Ltd.
- Printed wiring board16 Jul 2026US 2026/0206136 A1Fujikura Ltd.
- Resin composition, article made therefrom, and use thereof2 Jul 2026US 2026/0184912 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
Most cited
By later US patents
- Porous substrate and conductive ink filled vias for printed circuits181US 5,346,750 AMatsushita Electric Industrial Co., Ltd. · 1994
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Multilayer printed circuit154US 5,716,663 AToranaga Technologies, Inc. · 1998
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Method of manufacturing organic substrate used for printed circuits112US 5,481,795 AMatsushita Electric Industrial Co., Ltd. · 1996