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US 12,598,700 B2Granted
Wiring board
AssigneeKYOCERA Corporation
InventorsHiroaki Sano, Toshifumi Higashi, Akira Imoto, Takafumi Yamaguchi, Sentarou Yamamoto
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Abstract
The wiring board includes an insulation layer made of ceramic and a conductor layer extending in a planar direction inside the insulation layer. The conductor layer is constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and has a layered structure in which a dense layer, a non-dense layer, and a dense layer are layered in layers in this order in a thickness direction.
Claims6
A wiring board comprising:
- an insulation layer made of ceramic;
- and
- a conductor layer extending in a planar direction inside the insulation layer, the conductor layer being constituted by a sintered body of a plurality of crystallites containing a metal as a main component, and having a layered structure in which a dense layer, a non-dense layer, and a dense layer are layered in layers in this order in a thickness direction of the conductor layer,
- wherein the conductor layer contains silica particles,
- wherein the silica particles are present on a surface of the conductor layer.
2 more elements
Dependencies are inferred from the claim text.