US 5,716,663 AGranted

Multilayer printed circuit

AssigneeToranaga Technologies, Inc.

InventorsMiguel A. Capote, Prudeep Gandhi, Hope M. Viajar, Wesley W. Walters, Catherine Gallagher

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Abstract

Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer as the principal components. The compositions may also comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; a reactive monomer or polymer; and a metal additive. Compositions comprising metal powder are ideally suited for creating the conductive paths and vias on printed circuits.

Claims32

Dependent claims

A method of preparing a multilayer printed circuit board which comprises the steps of:

(a) forming a first dielectric layer on a surface of a substrate wherein the first dielectric layer;
(b) forming one or more first conductor grooves in said first dielectric layer and applying a first conductive ink composition into said first one or more conductor grooves;
(c) heating the first conductive ink composition to a temperature and for a period of time sufficient to cure the first ink conductive composition whereby the cured first conductive ink composition forms first conductive traces;
(d) forming an insulating layer on the surface of said first dielectric layer;
(e) forming one or more vias in said insulating layer and applying a second conductive ink composition into said vias;
(f) heating the second conductive ink composition to a temperature and for a period of time sufficient to cure the second ink conductive composition whereby the cured second conductive ink composition in said vias are in electrical contact with one or more of said first traces;
(g) forming a second dielectric layer on the surface of said insulating layer wherein the second dielectric layer includes one or more second conductor grooves;
(h) applying a third conductive ink composition into said second conductor grooves;
(i) heating the third conductive ink composition to a temperature and for a period of time sufficient to cure the third ink conductive composition whereby the cured third conductive ink composition forms second conductive traces that are in electrical contact with the cured second conductive ink composition in said one or more of said vias.

6 more elements

A method of preparing a multilayer printed circuit board which comprises the steps of:

(a) depositing a first conductive ink composition onto the surface of a substrate which defines a first circuit pattern;
(b) curing said first conductive ink composition;
(c) depositing a first dielectric material on the surface of said first circuit pattern so as to define one or more vias that are not coated with said first dielectric material;
(d) depositing a second conductive ink composition onto the surface of said first dielectric material and into said one or more vias, wherein the second conductive ink composition defines a second circuit pattern that is in communication with said one or more first vias;
and
(e) curing said second conductive ink composition.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/483,079Filed 7 Jun 1995 · continuation in part
Priority: 9 Feb 1990
Granted: 10 Feb 1998
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

H05K 3/4664
By building the multilayer layer by layer, i.e. build-up multilayer circuits: adding a circuit layer by thick film methods, e.g. printing…
B23K 35/0222
Characterised by mechanical features, e.g. shape: for use in soldering or brazing
B23K 35/36
Characterised by the composition or nature of the material: selection of non-metallic compositions, e.g. coatings or fluxes ; Selection of…
H01B 1/22
Conductive material dispersed in non-conductive organic material: the conductive material comprising metals or alloys

Family

Serial477,678Parent of this continuation-in-part · filed 9 Feb 1990
Serial769,892Parent of this division · filed 1 Oct 1991
Serial324,060Parent of this continuation-in-part · filed 17 Oct 1994
US 5,376,403 AParent of this division
US 5,716,663 AThis patent

From the US filing history. Foreign family members aren’t listed.