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US 2026/0206136 A1Published application
Printed wiring board
AssigneeFujikura Ltd.
InventorsNobuaki Inoue, Nobuki Ueta
Life of this patent
Estimating the term…
Abstract
A printed wiring board includes an insulating layer, a conductive layer disposed on the insulating layer, and a via. The via penetrates through the insulating layer, is electrically connected to the conductive layer, and includes bismuth regions containing a bismuth as a main component. A total outer perimeter length of the bismuth regions per unit area of a cross section of the via is equal to or less than 0.25/μm.
Claims6
A printed wiring board comprising:
- an insulating layer;
- a conductive layer disposed on the insulating layer;
- and
- a via that:
- penetrates the insulating layer,
- is electrically connected to the conductive layer, and
- includes bismuth regions containing a bismuth as a main component, wherein
- a total outer perimeter length of the bismuth regions per unit area of a cross section of the via is equal to or less than 0.25/μm.
5 more elements
A printed wiring board comprising:
- an insulating layer;
- an electrode disposed on the insulating layer;
- and
- a via that:
- penetrates the insulating layer,
- is electrically connected to the electrode, and
- includes a spherical bismuth region containing a bismuth as a main component.
4 more elements
Dependencies are inferred from the claim text.