H05K 2201/0266
Size distribution
H05K2201/0266 (Size distribution) appears on 122 US grants and 179 published applications in this corpus.
Search patents in H05K- Granted patents
- 122
- Published applications
- 179
- Assignees
- 108
- Inventors
- 429
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 2 |
| 2002 | 1 | 1 |
| 2003 | 3 | 4 |
| 2004 | 2 | 1 |
| 2005 | 1 | 6 |
| 2006 | 0 | 4 |
| 2007 | 4 | 10 |
| 2008 | 3 | 5 |
| 2009 | 4 | 13 |
| 2010 | 5 | 8 |
| 2011 | 6 | 6 |
| 2012 | 6 | 13 |
| 2013 | 4 | 4 |
| 2014 | 5 | 8 |
| 2015 | 1 | 8 |
| 2016 | 6 | 7 |
| 2017 | 7 | 8 |
| 2018 | 5 | 5 |
| 2019 | 3 | 7 |
| 2020 | 1 | 3 |
| 2021 | 6 | 6 |
| 2022 | 3 | 18 |
| 2023 | 12 | 7 |
| 2024 | 9 | 12 |
| 2025 | 4 | 10 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board15 Sep 2026US 12,739,972 B2KYOCERA Corporation
- Wiring board and manufacturing method therefor28 Jul 2026US 12,696,385 B2Toppan Holdings Inc.
- Printed wiring board10 Feb 2026US 12,550,255 B2Ibiden Co., Ltd.
- Wiring board13 Jan 2026US 12,526,922 B2Shinko Electric Industries Co., Ltd.
- Dielectric substrate and method of forming the same19 Aug 2025US 12,391,850 B2Versiv Composites Limited
- Circuit board, and semiconductor package comprising same20 Aug 2026US 2026/0247530 A1LG Innotek Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
- Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation5 Mar 2026US 2026/0068042 A1Proterial, Ltd.
- Wiring substrate and semiconductor device18 Dec 2025US 2025/0386431 A1Shinko Electric Industries Co., Ltd.
- Wiring board and mounting structure using the wiring board18 Dec 2025US 2025/0386433 A1KYOCERA Corporation
Most cited
By later US patents
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Method for electrically and mechanically connecting at least two conductive layers102US 5,502,889 ASheldahl, Inc. · 1996
- Conductive adhesive film techniques83US 5,225,966 AAT&T Bell Laboratories · 1993
- Multilayer electronic circuit having a conductive adhesive83US 5,688,584 ASheldahl, Inc. · 1997
- Anisotropic-electroconductive adhesive film81US 4,731,282 AHitachi Chemical Company, Ltd. · 1988