Multilayer electronic circuit having a conductive adhesive

A multilayer circuit board comprising:

• at least three conductive layers, each having a conductive pattern and a plurality of contact pads defined thereon, with two of the at least three conductive layers being designated first and second conductive layers, at least two contact pads being respectively disposed on the first and second conductive layers and opposing one another to define opposing interconnecting pads, the first conductive layer affixed to a first insulating substrate;
• and
• an electrically interconnecting adhesive layer interposed between the first and second conductive layers for mechanically connecting the first and second conductive layers in a superposed relationship with a connected distance therebetween, and for electrically connecting the opposing interconnecting pads on the first and second conductive layers, the interconnecting layer being conductive across a thickness thereof and being non-conductive throughout a coplanar direction thereof, and being disposed substantially throughout an overlapping portion of the first and second conductive layers, the interconnecting layer comprising a non-conductive adhesive having a first plurality of deformable conductive metallic particles dispersed substantially uniformly throughout the adhesive such that each particle is electrically insulated from substantially every other particle, the particles and the insulating substrate having substantially similar coefficients of thermal expansion that are within 25% of one another, and the particles having a diameter that is about 90-110% of the distance between the first and second conductive layers.