Wiring board and manufacturing method therefor
AssigneeToppan Holdings Inc.
InventorTomoyuki Ishii
Life of this patent
Estimating the term…
Abstract
A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second conductive layer is smaller than the area of the first insulating layer. A region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region. A surface roughness of the second region is larger than a surface roughness of the first region.
Claims12
A wiring board, comprising:
- a substrate having an insulating surface;
- a first seed layer provided on the substrate;
- a first conductive layer provided on the first seed layer;
- a first insulating layer provided on the first conductive layer;
- a second seed layer provided on the first insulating layer;
- a second conductive layer provided on the second seed layer;
- and
- a second insulating layer provided around the first seed layer, the first conductive layer, the first insulating layer, the second seed layer, and the second conductive layer, wherein
- an area of the first insulating layer is smaller than an area of the first conductive layer,
- an area of the second conductive layer is smaller than the area of the first insulating layer,
- a region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region, and
- a surface roughness of the second region is larger than a surface roughness of the first region.
Dependencies are inferred from the claim text.