Dielectric substrate and method of forming the same
AssigneeVersiv Composites Limited
InventorsJennifer Adamchuk, Dale Thomas, Meghann White, Sethumadhavan Ravichandran, Gerard T. Buss
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Abstract
The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
Claims17
A copper clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
- a first fluoropolymer based adhesive layer, a polyimide layer in direct contact with the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer,
- wherein the first filled polymer layer comprises a first resin matrix component comprising a perfluoropolymer;
- and
- a first ceramic filler component,
- wherein the first ceramic filler component comprises a first filler material comprising a silica filler material,
- wherein the silica filler material further comprises a mean particle size of at not greater than about 10 microns,
- wherein a particle size distribution of the silica filler material comprises a D10 of at least about 0.2 microns and not greater than about 1.6 microns, and
- wherein a particle size distribution of the silica filler material comprises a D50 of at least about 0.5 microns and not greater than about 2.7 microns.
A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
- a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
- a first fluoropolymer based adhesive layer, a polyimide layer in direct contact with the fluoropolymer based adhesive layer, and a first filled polymer layer the polyimide layer,
- wherein the first filled polymer layer comprises a first resin matrix component comprising a perfluoropolymer;
- and a first ceramic filler component, wherein the first ceramic filler component comprises a first filler material comprising a silica filler material, and wherein the silica filler material further comprises a mean particle size of at not greater than about 10 microns,
- wherein a particle size distribution of the silica filler material comprises a D10 of at least about 0.2 microns and not greater than about 1.6 microns, and
- wherein a particle size distribution of the silica filler material comprises a D50 of at least about 0.5 microns and not greater than about 2.7 microns.
A method of forming a dielectric substrate, wherein the method comprises:
- providing a first fluoropolymer based adhesive layer;
- providing a polyimide layer in direct contact with the first fluoropolymer based adhesive layer;
- combining a first resin matrix precursor component comprising a perfluoropolymer and a first ceramic filler precursor component to form a forming mixture;
- and
- forming the forming mixture into a first filled polymer layer overlying the polyimide layer, wherein the first ceramic filler precursor component comprises a silica filler material,
- wherein the silica filler material further comprises a mean particle size of not greater than about 10 microns,
- wherein a particle size distribution of the silica filler material comprises a D10 of at least about 0.2 microns and not greater than about 1.6 microns, and
- wherein a particle size distribution of the silica filler material comprises a D50 of at least about 0.5 microns and not greater than about 2.7 microns.
Dependencies are inferred from the claim text.