Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation
AssigneeProterial, Ltd.
InventorsShun TAKANO, Takashi Nogawa
Life of this patent
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Abstract
A low-cost ceramic circuit board that offers enhanced design flexibility in circuit layer thickness by increasing the bonding strength between a circuit layer and a ceramic substrate. A ceramic circuit board includes a ceramic substrate and a metal circuit layer formed on the ceramic substrate. The metal circuit layer contains Cu, Mg, at least one element selected from the group including Sn, Sb, and Bi, and at least one active metal element selected from Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W.
Claims19
A ceramic circuit board comprising:
- a ceramic substrate;
- and
- a metal circuit layer formed on the ceramic substrate, wherein
- the metal circuit layer contains
- Cu,
- Mg,
- at least one element selected from the group consisting of Sn, Sb, and Bi, and
- at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W.
A method for manufacturing a ceramic circuit board, the method comprising:
- placing a brazing material for circuit formation on a ceramic substrate in such a manner that the brazing material for circuit formation corresponds to a circuit pattern, the brazing material for circuit formation containing
- Cu
- Mg,
- at least one first element selected from the group consisting of Sn, Sb, and Bi, and
- at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W;
- and
- heating and holding the ceramic substrate on which the brazing material for circuit formation has been placed.
A brazing material for circuit formation comprising:
- Cu;
- Mg;
- at least one first element selected from the group consisting of Sn, Sb, and Bi;
- and
- at least one active metal element selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, and W.
Dependencies are inferred from the claim text.