H05K 2201/0269
Non-uniform distribution or concentration of particles
H05K2201/0269 (Non-uniform distribution or concentration of particles) appears on 67 US grants and 94 published applications in this corpus.
Search patents in H05K- Granted patents
- 67
- Published applications
- 94
- Assignees
- 49
- Inventors
- 237
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 4 |
| 2007 | 1 | 1 |
| 2008 | 1 | 6 |
| 2009 | 1 | 6 |
| 2010 | 2 | 6 |
| 2011 | 3 | 1 |
| 2012 | 7 | 4 |
| 2013 | 1 | 0 |
| 2014 | 2 | 11 |
| 2015 | 2 | 9 |
| 2016 | 4 | 4 |
| 2017 | 5 | 5 |
| 2018 | 3 | 3 |
| 2019 | 6 | 4 |
| 2020 | 1 | 5 |
| 2021 | 8 | 5 |
| 2022 | 2 | 5 |
| 2023 | 4 | 4 |
| 2024 | 4 | 3 |
| 2025 | 1 | 2 |
| 2026 | 1 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Method for manufacturing functionally graded composite material for PCB having high heat dissipating properties and electric insulating properties, and functionally graded composite material manufactured thereby30 Sep 2025US 12,427,573 B2Pukyong National University Industry-University Cooperation Foundation
- Power converter24 Dec 2024US 12,176,687 B2Hamilton Sundstrand Corporation
- Wiring board24 Dec 2024US 12,177,971 B2KYOCERA Corporation
- Wiring board7 May 2024US 11,979,981 B2KYOCERA Corporation
- Component carrier and method for manufacturing a component carrier5 Mar 2026US 2026/0068043 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring circuit board and method of producing the wiring circuit board5 Mar 2026US 2026/0068044 A1Nitto Denko Corporation
- Component carrier, method for manufacturing a component carrier and component carrier assembly5 Mar 2026US 2026/0068724 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ceramic wiring board, electronic device, and electronic module19 Jun 2025US 2025/0203768 A1KYOCERA Corporation
- Coating agent and method for manufacturing module using the coating agent6 Feb 2025US 2025/0048560 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Porous substrate and conductive ink filled vias for printed circuits181US 5,346,750 AMatsushita Electric Industrial Co., Ltd. · 1994
- Method of manufacturing organic substrate used for printed circuits112US 5,481,795 AMatsushita Electric Industrial Co., Ltd. · 1996
- Multilayer ceramic substrate with graded vias30US 5,260,519 AInternational Business Machines Corporation · 1993
- Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board29US 6,261,671 B1Ibiden Co., Ltd. · 2001
- Multilayer ceramic substrate with capped vias13US 5,293,504 AInternational Business Machines Corporation · 1994