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US 5,293,504 AGranted
Multilayer ceramic substrate with capped vias
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Charles H. Perry, Donald R. Wall
Life of this patent
Estimating the term…
Abstract
Disclosed is a multilayer ceramic substrate for electronic applications including: (a) at least one internal layer having vias at least partially filled with a metallic material; (b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer; and (c) a cap of material interposed between the aligned vias. Also disclosed is a method of forming the multilayer ceramic substrate.
Claims31
A multilayer ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias at least partially filled with a metallic material;
- (b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer;
- and
- (c) a cap of material interposed between the aligned vias wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material and has an amount of ceramic material that is equal to or less than that in the sealing layer vias.
1 more element
A multilayer ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias at least partially filled with a metallic material;
- (b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer;
- and
- (c) a cap of material interposed between the aligned vias wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material that has less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias.
1 more element
A multilayer glass ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias at least partially filled with a metallic material;
- (b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of glass ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer;
- and
- (c) a cap of material interposed between the aligned vias wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material and has an amount of glass ceramic material that is equal to or less than that in the sealing layer vias.
1 more element
A multilayer glass ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias at least partially filled with a metallic material;
- (b) at least one sealing layer having vias at least partially filled with a composite material that is a mixture of glass ceramic and metallic materials wherein at least one via from the internal layer is aligned with at least one via from the sealing layer;
- and
- (c) a cap of material interposed between the aligned vias wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material that has less glass ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias.
1 more element
A method of fabricating a multilayer ceramic substrate for electronic applications, the method comprising the steps of:
- providing at least one unsintered internal layer having vias at least partially filled with a metallic material;
- providing at least one unsintered sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials;
- depositing a cap of material on at least one via of the internal layer or screening layer wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material and has an amount of ceramic material that is equal to or less than that in the sealing layer vias;
- stacking the internal and sealing layers so that at least one via from the internal layer is aligned with at least one via from the sealing layer and the cap of material is between the aligned vias;
- and
- sintering the internal and sealing layers to form a multilayer ceramic substrate.
3 more elements
A method of fabricating a multilayer ceramic substrate for electronic applications, the method comprising the steps of:
- providing at least one unsintered internal layer having vias at least partially filled with a metallic material;
- providing at least one unsintered sealing layer having vias at least partially filled with a composite material that is a mixture of ceramic and metallic materials;
- depositing a cap of material on at least one via of the internal layer or screening layer wherein the cap of material is selected from the group of materials consisting of a metallic material and a composite material that is a mixture of ceramic and metallic materials and wherein the cap material is a composite material and has less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias;
- stacking the internal and sealing layers so that at least one via from the internal layer is aligned with at least one via from the sealing layer and the cap of material is between the aligned vias;
- and
- sintering the internal and sealing layers to form a multilayer ceramic substrate.
3 more elements
Dependencies are inferred from the claim text.