Multilayer ceramic substrate with graded vias
AssigneeInternational Business Machines Corporation
InventorsJohn U. Knickerbocker, Charles H. Perry, Donald R. Wall
Life of this patent
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Abstract
Disclosed is a multilayer ceramic substrate for electronic applications including: (a) at least one internal layer having vias filled with a metallic material; (b) at least one sealing layer having vias filled with a composite material that is a mixture of ceramic and metallic materials; and (c) at least one transition layer located between the internal and sealing layers having vias filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias. Also disclosed is a method of forming the multilayer ceramic substrate.
Claims32
A multilayer ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias filled with a metallic material;
- (b) at least one sealing layer having vias filled with a composite material that is a mixture of ceramic and metallic materials;
- and
- (c) at least one transition layer located between the internal and sealing layers having vias filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias, wherein the vias from the at least one sealing layer, the vias from the at least one transition layer, and the vias from the at least one internal layer, respectively, are in alignment with each other.
A multilayer glass ceramic substrate for electronic applications comprising:
- (a) at least one internal layer having vias filled with a metallic material;
- (b) at least one sealing layer having vias filled with a composite material that is a mixture of glass ceramic and metallic materials;
- and
- (c) at least one transition layer located between the internal and sealing layers having vias filled with a composite material that is a mixture of glass ceramic and metallic materials but having less glass ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias, wherein the vias from the at least one sealing layer, the vias from the at least one transition layer, and the vias from the at least one internal layer, respectively, are in alignment with each other.
A method of fabricating a multilayer ceramic substrate for electronic applications, the multilayer ceramic substrate comprising at least one internal layer having vias filled with a metallic material and at least one sealing layer having vias filled with a composite material that is a mixture of ceramic and metallic materials, the method comprising the step of:
- interposing at least one transition layer between the internal layer and the sealing layer, the transition layer having vias filled with a composite material that is a mixture of ceramic and metallic materials but having less ceramic and more metallic material than the sealing layer vias and less metallic material than the internal layer vias, wherein the vias from the at least one sealing layer, the vias from the at least one transition layer, and the vias from the at least one internal layer, respectively, are in alignment with each other.
Dependencies are inferred from the claim text.