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US 12,590,228 B2Granted
Curable adhesive composition for die attach
AssigneeHenkel AG & Co. KGaA
InventorsYang Ti, Qili Wu, Wei Yao, Jiawen Zhao
Life of this patent
Estimating the term…
Abstract
This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.
Claims16
A curable adhesive composition, comprising
- (1) a thermosetting or thermoplastic resin component,
- (2) a plurality of particles of a first metal or alloy having a melting point from 50° C. to 300° C., a D50 particle size of from 10 μm to 100 μm, and a tap density of 3-12 g/cm3, wherein the particles of the first metal or alloy comprise at least one of indium (In), germanium (Ga), bismuth (Bi), or tin (Sn),
- (3) a plurality of particles of a second metal or alloy having a melting point higher than 300° C., and a D50 particle size of from 0.1 μm to less than 10 μm, wherein the particles of the second metal or alloy comprise at least one of gold (Au), silver (Ag), nickel (Ni), aluminum (Al) or copper (Cu), and wherein the particles of the second metal or alloy are coated with at least two layers of an organic substance, and
- (4) a curing agent.
1 more element
Dependencies are inferred from the claim text.