Wiring board
AssigneeKYOCERA Corporation
InventorTakayuki Umemoto
Life of this patent
Estimating the term…
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AssigneeKYOCERA Corporation
InventorTakayuki Umemoto
Estimating the term…
The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.
A wiring board, comprising:
Dependencies are inferred from the claim text.