Wiring board
AssigneeKYOCERA Corporation
InventorsTadashi Nagasawa, Satoshi Yoshiura
Life of this patent
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Abstract
A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 μm and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 μm and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 μm or 25-100 μm and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.
Claims5
A wiring board comprises:
- an insulating layer having a first surface and a second surface on an opposite side of the first surface, and including organic resin having a highest volume in the insulating layer, and inorganic particles;
- a first metal layer which is disposed on the first surface;
- and
- a second metal layer which is disposed on the second surface, wherein
- the insulating layer having:
- a thickness of 75 μm or more and 1000 μm or less, and
- a storage modulus of 4 GPa or more and 7 GPa or less, the first metal layer having:
- a thickness of 1.5 μm or more and 10 μm or less, and
- a first metal layer coverage of 5% or more and 25% or less, wherein the first metal layer coverage is an area ratio of the first metal layer to the first surface
- the second metal layer having:
- a thickness of 3 μm or more and 10 μm or less or 25 μm or more and 100 μm or less, and
- a second metal layer coverage of 85% or more, wherein the second metal layer coverage is an area ratio of the second metal layer to the second surface, and
- a first ratio of the organic resin on the first surface is larger than a second ratio of the organic resin on the second surface.
Dependencies are inferred from the claim text.