Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Yoshitaka Ono, Masato Kawade, Kouta Noda, Youko Nishiwaki
Life of this patent
Estimating the term…
Abstract
The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 μm.
Claims30
An adhesive for electroless plating formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, characterized in that the heat-resistant resin particles have an average particle size of not more than 1.5 μm.
A printed circuit board comprising a substrate, a cured adhesive layer for electroless plating having a roughened surface, and a conductor circuit formed on the roughened surface of the adhesive layer,
- said adhesive layer being composed of an adhesive for electroless plating formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment,
- said heat-resistant resin particles having an average particle size of not more than 1.5 μm.
A printed circuit board comprising a substrate, a conductor circuit formed on the substrate, an adhesive layer for electroless plating formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, a roughened surface formed on a surface of the adhesive layer by dissolving and removing the cured heat-resistant particles, and an upper conductor circuit is formed on the roughened surface,
- said adhesive layer for electroless plating has more heat-resistant particles at the side of the substrate than that at the opposite side thereof.
A material composition for preparing an adhesive for electroless plating, comprising:
- a resin composition of a first group comprising uncured thermosetting resin which becomes hardly soluble in an acid or oxidizing agent through curing treatment;
- a resin composition of a second group comprising cured heat-resistant resin particles soluble an acid or oxidizing agent and having an average particle size of not more than 1.5 μm, thermoplastic resin, and organic solvent;
- and
- a curing agent composition of a third group, wherein each group is prepared in advance for mixture, and preserved separately from one another.
Dependencies are inferred from the claim text.