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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsAkihito Hatakeyama, Hiroshi Sogo, Tamao Kojima, Yasuhiko Horio, Masahide Tsukamoto, Yasushi Fukumura
Estimating the term…
A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
An organic substrate used for printed circuits, which comprises a porous raw material, electro-conductive paste filled in through-holes formed in said porous raw material, and metal foils applied onto opposite surfaces of said porous raw material, said metal foils adhered to the opposite surfaces of said porous raw material being electrically connected to each other through the electro-conductive paste by compressing said porous raw material applied with said metal foils through heating and pressurization.
Dependencies are inferred from the claim text.