Wiring circuit board and method of producing the wiring circuit board
AssigneeNitto Denko Corporation
InventorsKenta FUKUSHIMA, Shusaku SHIBATA, Yusaku TAMAKI
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Abstract
A wiring circuit board has a metal support substrate, a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction, and a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction. The metal support substrate and/or the conductor layer contain(s) a copper alloy, and the copper alloy contains a first metal consisting of copper and a second metal that can be alloyed with copper. In the metal support substrate and/or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.
Claims6
A wiring circuit board comprising:
- a metal support substrate;
- a base insulating layer disposed on a one-side surface of the metal support substrate in a thickness direction;
- and
- a conductor layer disposed on a one-side surface of the base insulating layer in the thickness direction,
- wherein the metal support substrate and/or the conductor layer contain(s) a copper alloy,
- wherein the copper alloy contains:
- a first metal consisting of copper;
- and
- a second metal that can be alloyed with the copper, and
- wherein in the metal support substrate and/or the conductor layer, the copper alloy has a sea-island structure including a sea portion having a continuous shape and an island portion having a discontinuous shape.
Dependencies are inferred from the claim text.