Coating agent and method for manufacturing module using the coating agent
AssigneeSekisui Chemical Co., Ltd.
InventorsSatoru KUROZUMI, Masao INOUE
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Abstract
An electronic component having thermal insulation properties and insulation resistance, which is capable of being used for modularization by injection molding or the like. The electronic component has a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer contains at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.
Claims8
A method for manufacturing an electronic module having an electronic component, a coating layer, and an outer package for covering the surface of the electronic component, comprising:
- the step of disposing the electronic component in a mold to perform injection molding, and forming the outer package so as to cover the surface of the electronic component,
- wherein the electronic component comprises a conductive adhesive member portion and a circuit board on which an electronic element is mounted,
- wherein the coating layer coats a surface of the conductive adhesive member portion,
- wherein the outer package comprises a first thermoplastic resin and covers a surface of the electronic components,
- wherein the coating layer comprises at least a second thermoplastic resin and hollow particles,
- wherein the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board, and
- wherein the hollow particles are either single-hole hollow particles or multi-hole hollow particles.
Dependencies are inferred from the claim text.