H05K 2201/0272
Mixed conductive particles, i.e. using different conductive particles
Official title: Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
H05K2201/0272 (Mixed conductive particles, i.e. using different conductive particles) appears on 167 US grants and 180 published applications in this corpus.
Search patents in H05K- Granted patents
- 167
- Published applications
- 180
- Assignees
- 135
- Inventors
- 532
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 1 |
| 2002 | 4 | 7 |
| 2003 | 6 | 4 |
| 2004 | 2 | 4 |
| 2005 | 5 | 4 |
| 2006 | 1 | 7 |
| 2007 | 2 | 9 |
| 2008 | 3 | 6 |
| 2009 | 2 | 18 |
| 2010 | 6 | 14 |
| 2011 | 12 | 11 |
| 2012 | 7 | 6 |
| 2013 | 5 | 10 |
| 2014 | 4 | 14 |
| 2015 | 13 | 8 |
| 2016 | 6 | 7 |
| 2017 | 5 | 4 |
| 2018 | 4 | 5 |
| 2019 | 3 | 11 |
| 2020 | 2 | 2 |
| 2021 | 8 | 5 |
| 2022 | 3 | 9 |
| 2023 | 4 | 4 |
| 2024 | 5 | 1 |
| 2025 | 4 | 3 |
| 2026 | 1 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Conductive coating material and circuit former14 Oct 2025US 12,441,896 B2Fujikura Kasei Co., Ltd.
- Method for manufacturing functionally graded composite material for PCB having high heat dissipating properties and electric insulating properties, and functionally graded composite material manufactured thereby30 Sep 2025US 12,427,573 B2Pukyong National University Industry-University Cooperation Foundation
- Printed wiring board15 Apr 2025US 12,279,368 B2Ibiden Co., Ltd.
- Wiring board and display device15 Apr 2025US 12,279,378 B2KYOCERA Corporation
- Printed wiring board16 Jul 2026US 2026/0206136 A1Fujikura Ltd.
- Flexible Conductive Adhesives14 May 2026US 2026/0132317 A1Nanotech Energy, Inc.
- Component carrier and method for manufacturing a component carrier5 Mar 2026US 2026/0068043 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component carrier, method for manufacturing a component carrier and component carrier assembly5 Mar 2026US 2026/0068724 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for producing conductive base material, method for producing electronic device, method for producing electromagnetic shield film, method for producing sheet-like heating element, and conductive base material26 Feb 2026US 2026/0055513 A1Sato Holdings Kabushiki Kaisha
Most cited
By later US patents
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Multilayer printed circuit154US 5,716,663 AToranaga Technologies, Inc. · 1998
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Vertically interconnected electronic assemblies and compositions useful therefor111US 5,948,533 AOrmet Corporation · 1999
- Composite solder paste for flip chip bumping102US 5,803,340 ADelco Electronics Corporation · 1998