Vertically interconnected electronic assemblies and compositions useful therefor
AssigneeOrmet Corporation
InventorsCatherine A. Gallagher, Goran S. Matijasevic, Pradeep Gandhi, M. Albert Capote
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AssigneeOrmet Corporation
InventorsCatherine A. Gallagher, Goran S. Matijasevic, Pradeep Gandhi, M. Albert Capote
Estimating the term…
In accordance with the present invention, there are provided novel vertically interconnected assemblies and compositions useful therefore. Invention assemblies comprise substrate boards with multiple layer electronic assemblies. The multiple layers comprise individual layers of circuitry separated and adhered by dielectric materials selectively coated and/or filled with a transient liquid phase sintered (TLPS) material. The TLPS is formulated to be electrically conductive, and thereby serves to convey current between the layers of circuitry. In addition, the TLPS is easily workable so that it is amenable to automated, stepwise construction of multilayer circuitry without the need for labor intensive drilling and filling of conductive vias.
A specialty vertical interconnection assembly (via) structure, said structure comprising:
A specialty via interconnect structure comprising:
A specialty vertical interconnection assembly (via) structure comprising:
Dependencies are inferred from the claim text.