Method of making an interconnect substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorYuji Yukiiri
Life of this patent
Estimating the term…
Abstract
A method of making an interconnect substrate includes forming a first insulating layer containing a filler and covering a first interconnect layer, forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer, performing a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer, and forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.
Claims9
A method of making an interconnect substrate, comprising:
- forming a first insulating layer containing a filler and covering a first interconnect layer;
- forming a via hole in the first insulating layer by laser processing, the via hole exposing the first interconnect layer;
- performing, after the forming of the via hole, a heat treatment, plasma processing, and a desmear process in this order with respect to the first insulating layer;
- and
- forming, after the desmear process, a second interconnect layer including both an interconnect pattern formed on an upper surface of the first insulating layer and a via interconnect formed in the via hole.
Dependencies are inferred from the claim text.