H05K 2201/0242
Shape of an individual particle
H05K2201/0242 (Shape of an individual particle) appears on 878 US grants and 1,166 published applications in this corpus.
Search patents in H05K- Granted patents
- 878
- Published applications
- 1,166
- Assignees
- 550
- Inventors
- 2,541
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 10 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 10 | 0 |
| 1993 | 9 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 9 | 0 |
| 2000 | 5 | 0 |
| 2001 | 11 | 8 |
| 2002 | 13 | 20 |
| 2003 | 12 | 15 |
| 2004 | 13 | 27 |
| 2005 | 12 | 27 |
| 2006 | 17 | 44 |
| 2007 | 12 | 55 |
| 2008 | 19 | 59 |
| 2009 | 25 | 78 |
| 2010 | 35 | 75 |
| 2011 | 36 | 51 |
| 2012 | 48 | 55 |
| 2013 | 41 | 39 |
| 2014 | 39 | 55 |
| 2015 | 36 | 70 |
| 2016 | 45 | 62 |
| 2017 | 47 | 61 |
| 2018 | 39 | 54 |
| 2019 | 47 | 63 |
| 2020 | 47 | 68 |
| 2021 | 55 | 43 |
| 2022 | 37 | 31 |
| 2023 | 30 | 22 |
| 2024 | 27 | 39 |
| 2025 | 21 | 30 |
| 2026 | 17 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/026Nanotubes or nanowiresIndexing code339
- H05K 2201/0257NanoparticlesIndexing code245
- H05K 2201/0245Flakes, flat particles or lamellar particlesIndexing code178
- H05K 2201/0248Needles or elongated particlesIndexing code77
- H05K 2201/0251Non-conductive microfibersIndexing code75
- H05K 2201/0254Microballoons or hollow filler particlesIndexing code52
Recent patents
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Inlay, Component Carrier, and Method of Manufacturing the Inlay17 Sep 2026US 2026/0282220 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Laminate and method for forming laminate20 Aug 2026US 2026/0241412 A1Daikin Industries, Ltd.
- Film, laminated film, laminated plate, printed wiring board, antenna substrate, antenna module, metamaterial, and electromagnetic wave absorbing film20 Aug 2026US 2026/0247529 A1FUJIFILM Corporation
- Component Carrier13 Aug 2026US 2026/0239534 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Methods for manufacturing electronic and electromechanical elements and devices by thin-film deposition and imaging128US 6,348,295 B1Massachusetts Institute of Technology · 2002
- Methods and applications of non-planar imaging arrays124US 8,372,726 B2MC10, Inc. · 2013
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Printed circuit board having an integrated decoupling capacitive element117US 5,162,977 AStorage Technology Corporation · 1992