H05K 2201/0248
Needles or elongated particles
Official title: Needles or elongated particles; Elongated cluster of chemically bonded particles
H05K2201/0248 (Needles or elongated particles) appears on 77 US grants and 86 published applications in this corpus.
Search patents in H05K- Granted patents
- 77
- Published applications
- 86
- Assignees
- 63
- Inventors
- 229
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 3 |
| 2003 | 4 | 2 |
| 2004 | 4 | 6 |
| 2005 | 3 | 3 |
| 2006 | 3 | 4 |
| 2007 | 3 | 8 |
| 2008 | 2 | 2 |
| 2009 | 2 | 3 |
| 2010 | 1 | 9 |
| 2011 | 8 | 6 |
| 2012 | 4 | 4 |
| 2013 | 2 | 4 |
| 2014 | 4 | 3 |
| 2015 | 4 | 3 |
| 2016 | 3 | 3 |
| 2017 | 2 | 3 |
| 2018 | 3 | 1 |
| 2019 | 0 | 2 |
| 2020 | 3 | 4 |
| 2021 | 0 | 3 |
| 2022 | 1 | 1 |
| 2023 | 2 | 3 |
| 2024 | 2 | 2 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro-roughened electrodeposited copper foil and copper clad laminate17 Feb 2026US 12,557,213 B2Co-Tech Development Corp.
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Concentrated liquid of polishing composition and polishing method using same1 Apr 2025US 12,264,265 B2Fujimi Incorporated
- Micro-roughened electrodeposited copper foil and copper clad laminate15 Oct 2024US 12,120,816 B2Co-Tech Development Corp.
- Nanocomposite material for ultraviolet curable direct write semiconductor applications17 Sep 2024US 12,096,561 B2Raytheon Company
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Semiconductor nanoparticle composite film, composite base and device including the same, and method for manufacturing semiconductor nanoparticle composite film3 Apr 2025US 2025/0109022 A1Osaka University
- Micro-roughened electrodeposited copper foil and copper clad laminate24 Oct 2024US 2024/0357740 A1Co-Tech Development Corp.
- Applying a solderable surface to conductive ink15 Feb 2024US 2024/0057266 A1International Business Machines Corporation
- Ceramic substrate, aln single crystal, aln whisker, and aln whisker composite28 Sep 2023US 2023/0303455 A1U-MAP Co., Ltd.
Most cited
By later US patents
- Nanowire-based transparent conductors and applications thereof72US 8,094,247 B2Cambrios Technologies Corporation · 2012
- Process for producing multilayer printed circuit board for wire bonding71US 5,879,568 AHitachi, Ltd. · 1999
- Nanowire-based transparent conductors and applications thereof67US 8,018,568 B2Cambrios Technologies Corporation · 2011
- Anisotropic resistance bonding technique59US 4,170,677 AThe United States of America as represented by the Secretary of the Army · 1979
- Nanowire-based transparent conductors and applications thereof45US 8,174,667 B2Cambrios Technologies Corporation · 2012