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US 12,457,693 B2Granted
Applying a solderable surface to conductive ink
AssigneeInternational Business Machines Corporation
InventorsMark K. Hoffmeyer, Prabjit Singh
Life of this patent
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Abstract
Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
Claims9
A method for applying a solderable surface to conductive ink, comprising:
- partially curing a conductive ink trace;
- applying, to the partially cured conductive ink trace, a conductive paste, wherein the conductive paste is uncured and includes a solvent and conductive particles;
- applying, prior to curing the partially cured conductive ink trace and the conductive paste, a magnetic field to the conductive paste to align the conductive particles in the conductive paste;
- and
- curing the partially cured conductive ink trace and the conductive paste.
2 more elements
Dependencies are inferred from the claim text.