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US 12,096,561 B2Granted
Nanocomposite material for ultraviolet curable direct write semiconductor applications
AssigneesRaytheon Company, University of Massachusetts
InventorsCraig A. Armiento, Yuri Piro, Andrew M. Luce, Emily Lamport, Oshadha Ranasingha, Christopher R. Areias, Christopher N. Kuncho, Alkim Akyurtlu, Edward D. Kingsley
Life of this patent
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Abstract
A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.
Claims17
A chip-embedded printed circuit board comprising:
- a cavity in a printed circuit board;
- a chip in the cavity of the printed circuit board;
- and
- a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board;
- wherein the thixotropic dielectric filler includes:
- a plurality of particles with an aspect ratio of about 2:1 to about 30:1;
- an acrylate oligomer;
- a photoinitiator that absorbs light with a wavelength of about 280 to about 320 nanometers;
- and
- a photoinitiator that absorbs light with a wavelength of about 320 to about 400 nanometers.
7 more elements
A composition for making a dielectric filler comprising:
- a plurality of particles with an aspect ratio of about 2:1 to about 30:1;
- an acrylate oligomer;
- a photoinitiator that absorbs light with a wavelength of about 280 to about 320 nanometers;
- and
- a photoinitiator that absorbs light with a wavelength of about 320 to about 400 nanometers.
2 more elements
Dependencies are inferred from the claim text.