In situ method for forming a capacitive PCB
AssigneeZycon Corporation
InventorGregory L. Lucas
Life of this patent
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Abstract
An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB.
Claims11
An in situ method of forming a bypass capacitor element internally within a capacitive printed circuit board (PCB), comprising the steps of selecting an uncured dielectric sheet and conductive foils as components of the bypass capacitor element, arranging the conductive foils as layers adjacent both sides of the uncured dielectric sheet and between other PCB layers, and thereafter laminating the conductive foils to the dielectric sheet in a final lamination step simultaneously forming the capacitive PCB and the internal bypass capacitor element.
Dependencies are inferred from the claim text.