H05K 2201/0245
Flakes, flat particles or lamellar particles
H05K2201/0245 (Flakes, flat particles or lamellar particles) appears on 178 US grants and 202 published applications in this corpus.
Search patents in H05K- Granted patents
- 178
- Published applications
- 202
- Assignees
- 143
- Inventors
- 516
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 3 | 10 |
| 2003 | 3 | 3 |
| 2004 | 3 | 3 |
| 2005 | 2 | 3 |
| 2006 | 2 | 1 |
| 2007 | 1 | 10 |
| 2008 | 5 | 14 |
| 2009 | 3 | 8 |
| 2010 | 6 | 10 |
| 2011 | 7 | 5 |
| 2012 | 3 | 5 |
| 2013 | 6 | 7 |
| 2014 | 4 | 10 |
| 2015 | 6 | 15 |
| 2016 | 9 | 13 |
| 2017 | 11 | 13 |
| 2018 | 9 | 6 |
| 2019 | 7 | 11 |
| 2020 | 7 | 8 |
| 2021 | 10 | 14 |
| 2022 | 7 | 8 |
| 2023 | 8 | 6 |
| 2024 | 11 | 8 |
| 2025 | 4 | 7 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed wiring board2 Jun 2026US 12,648,081 B2Ibiden Co., Ltd.
- Curable adhesive composition for die attach31 Mar 2026US 12,590,228 B2Henkel AG & Co. KGaA
- Conductive coating material and circuit former14 Oct 2025US 12,441,896 B2Fujikura Kasei Co., Ltd.
- Package component1 Jul 2025US 12,349,268 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Aerosol jet printed flexible graphene circuits for electrochemical sensing and biosensing20 May 2025US 12,306,132 B2Iowa State University Research Foundation, Inc.
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Laminate and method for forming laminate20 Aug 2026US 2026/0241412 A1Daikin Industries, Ltd.
- Conductive Dispersions And Methods Of Manufacture29 Jan 2026US 2026/0028497 A1Nanotech Energy, Inc.
- Method for producing varnish-like cyclic olefin copolymer composition, cyclic olefin copolymer composition, crosslinked product, film, or sheet, laminate, circuit board, electronic device, and prepreg25 Dec 2025US 2025/0388767 A1Mitsui Chemicals, Inc.
- Aerosol jet printed flexible graphene circuits for electrochemical sensing and biosensing23 Oct 2025US 2025/0327771 A1Iowa State University Research Foundation, Inc.
Most cited
By later US patents
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Conductive elastomer for grafting to thermoplastic and thermoset substrates71US 6,180,221 B2Thomas & Betts International, Inc. · 2001
- Conductive adhesive having a palladium matrix interface between two metal surfaces52US 6,425,772 B1International Business Machines Corporation · 2002
- Assembly using electrically conductive cement48US 5,326,636 APoly-Flex Circuits, Inc. · 1994
- Conductive elastomer for grafting to a metal substrate43US 5,977,489 AThomas & Betts International, Inc. · 1999