Package component

A package component, comprising:

• a first substrate comprising a first surface and a second surface opposite to the first surface;
• a first conductive layer over the first surface, the first conductive layer comprising:
• a first conductive feature;
• and
• a second conductive feature over the first conductive feature, wherein a resistance of the second conductive feature is lower than a resistance of the first conductive feature;
• a dielectric layer over the first conductive layer;
• a second conductive layer over the second surface;
• and
• a first via structure penetrating through the first substrate and electrically connecting the second conductive layer to the first conductive layer, wherein the first via structure has an inner surface exposed to an environment,
• wherein the first via structure is coupled to a sidewall of the dielectric layer, a sidewall of the first conductive layer and a sidewall of the first substrate.

A package component, comprising:

• a first substrate comprising a first surface and a second surface opposite to the first surface;
• a second substrate disposed over the first substrate, wherein the second substrate has a third surface facing the first surface of the first substrate, and a fourth surface opposite to the third surface;
• a dielectric layer between the first substrate and the second substrate;
• a first conductive layer over the first surface, the first conductive layer comprising:
• a first conductive feature;
• and
• a second conductive feature over the first conductive feature, wherein a resistance of the second conductive feature is lower than a resistance of the first conductive feature;
• a second conductive layer over the second surface of the first substrate;
• a first via structure penetrating through the first substrate and electrically connecting the second conductive layer to the first conductive layer, wherein the first via structure comprises:
• a third conductive feature coupling the first conductive layer and the second conductive layer;
• and
• a fourth conductive feature over the third conductive feature, wherein the fourth conductive feature is separated from the second conductive layer and the first conductive layer by the third conductive feature, wherein a resistance of the fourth conductive feature is lower than a resistance of the third conductive feature;
• and
• a third conductive layer over the fourth surface of the second substrate,
• wherein the first via structure further penetrates through the second substrate and the dielectric layer, and electrically connects the third conductive layer to the first conductive layer and the second conductive layer.