H05K 2201/0254
Microballoons or hollow filler particles
H05K2201/0254 (Microballoons or hollow filler particles) appears on 52 US grants and 51 published applications in this corpus.
Search patents in H05K- Granted patents
- 52
- Published applications
- 51
- Assignees
- 58
- Inventors
- 162
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 2 | 3 |
| 2003 | 1 | 1 |
| 2004 | 2 | 3 |
| 2005 | 1 | 2 |
| 2006 | 2 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 4 |
| 2011 | 1 | 0 |
| 2012 | 1 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 4 |
| 2016 | 3 | 0 |
| 2017 | 2 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 1 |
| 2020 | 1 | 4 |
| 2021 | 3 | 3 |
| 2022 | 2 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 7 |
| 2025 | 3 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Printed wiring board10 Feb 2026US 12,550,255 B2Ibiden Co., Ltd.
- Mixed dielectric materials for improving signal integrity of integrated electronics packages13 Jan 2026US 12,525,495 B2Avago Technologies International Sales Pte. Limited
- Dielectric, copper clad laminate, circuit board, method for manufacturing copper clad laminate17 Jun 2025US 12,336,096 B1Nippon Pillar Packing Co., Ltd.
- Laminate, laminate with buildup layer, laminate with metal foil, and circuit board22 Apr 2025US 12,284,755 B2Sekisui Kasei Co., Ltd.
- Resin composition, prepreg, metal foil-clad laminate and printed circuit board16 Jul 2026US 2026/0206133 A1Zeon Corporation
- Microparticle-filled laminate material17 Apr 2025US 2025/0126708 A1Dell Products L. P.
- Coating agent and method for manufacturing module using the coating agent6 Feb 2025US 2025/0048560 A1Sekisui Chemical Co., Ltd.
- Sheet for component carrier comprising separate structures with filler particles having different hollow volume therein19 Sep 2024US 2024/0314927 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed wiring board8 Aug 2024US 2024/0268021 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Flame retardant, low dielectric constant microsphere filled laminate87US 5,126,192 AInternational Business Machines Corporation · 1992
- Dielectric composite59US 5,354,611 ARogers Corporation · 1994
- Fluorinated polymeric composition, fabrication thereof and use thereof49US 5,055,342 AInternational Business Machines Corporation · 1991
- Method for producing laminate board containing uniformly distributed filler particles43US 4,661,301 AToray Industries, Inc. · 1987
- Shape retaining flexible electrical circuit39US 4,997,702 ARogers Corporation · 1991