Shape retaining flexible electrical circuit
AssigneeRogers Corporation
InventorsSamuel Gazit, Gary W. Adams
Life of this patent
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Abstract
A printed circuit board composed of an epoxy impregnated nonwoven web substrate laminated to electrically conductive sheets is presented. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems. The printed circuit board also has improved thermal properties achieved through the addition of up to 70% by weight of low coefficient of thermal expansion (CTE) particulate fillers and/or the use of thermally stable reinforcement fibers in the non-woven web.
Claims10
A circuit material composite comprising:
- (a) a substrate including;
- a nonwoven web fabric;
- an epoxy resin impregnating said nonwoven web fabric, said epoxy resin having a glass transition in the range of about 10-60.degree. C., said glass transition having a breadth of about 20 to 30.degree. C.;
- filler material in said nonwoven web fabric and epoxy resin, said filler material comprising 20-70% by weight of the total composite and being comprised of inorganic filler-material or fibers wherein the coefficient of thermal expansion in the Z direction for the circuit material composite is in the range of 100-300 ppm/.degree.C.;
- and
- (b) a layer of conductive material on at least a portion of a surface of said substrate, said composite being flexible in the sense that it can be bent to a desired multiplanar shape and will retain that shape.
Dependencies are inferred from the claim text.