Method for producing laminate board containing uniformly distributed filler particles
AssigneeToray Industries, Inc.
InventorsReisuke Okada, Hisami Fujino
Life of this patent
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Abstract
A process for continuously molding a plate for an electrical printed circuit board wherein a resin containing uniformly distributed hollow microspheres having a specific gravity different from that of the resin is extruded into a vertically disposed moving double belt press maintained at a temperature which allows the extruded plate to harden almost completely. The plate exists the vertically disposed press maintaining a flexibility sufficient to be passed around a roller into a horizonal position where subsequent processing steps may be applied, such as lamination of reinforcing fiber and coating with a conductive material.
Claims8
A process for continuous molding of a plate for an electrical printed circuit board comprising a resin and hollow microspheres uniformly distributed in said resin, wherein the hollow microspheres have a specific gravity different from that of the resin, comprising the step of:
- extruding a mixture of a resin and hollow microspheres into a vertically disposed moving double belt press maintained at a temperature which allows the extruded plate to harden almost completely.
Dependencies are inferred from the claim text.